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BT-Epoxy (BT short for Bismaleimide-Triazine resin) is one of a number of thermoset resins used in printed circuit boards (PCBs). It is a mixture of epoxy resin, a common raw material for PCBs and BT resins. This is in turn a mixture of bismaleimide, which is also used as a raw material for PCBs and cyanate ester. Three cyano groups of the cyanate ester are trimerized to a triazine ring structure, hence the T in the name. In presence of a bismaleimide, the double bond of the maleimide group can copolymerize with the cyano groups to heterocyclic 6-membered aromatic ring structures with two nitrogen atoms (pyrimidines). The cure reaction occurs at temperatures up to 250 °C (482 °F), and is catalyzed by strongly basic molecules like Dabco (diazabicyclooctane) and 4-DMAP (4-dimethylaminopyridin). Products with very high glass transition temperatures (T_g) up to 300 °C (572 °F) and very low dielectric constant can be obtained. These properties make these materials very attractive for use in PCBs, which are often subjected to such conditions.

See Also

• Printed Circuit Boards
• Resins
• Epoxy
• Electronics manufacturing

References

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